Micron ramps up Singapore expansion with $24 billion NAND plant to address AI-driven memory demand

Micron Technology announces a $24 billion investment in a new wafer-fabrication plant in Singapore, aiming to boost NAND flash memory capacity amid surging AI and data centre requirements, with production expected from 2028.

US memory-chip maker Micron Technology has begun construction of a major wafer-fabrication plant in Singapore that the company says will cost about US$24 billion and expand its capacity for NAND flash memory used across consumer devices and in data centres powering artificial intelligence workloads. According to the announcement, the new facility will be built within Micron’s existing NAND complex in Woodlands and is expected to begin wafer output in the second half of 2028. (Sources: 2,5)

Micron described the project as an approximately US$24 billion investment phased over a decade, adding roughly 65,000 square metres of cleanroom space to its Singapore campus. The company positions the expansion as a response to surging demand for NAND technology driven by generative AI and other data‑intensive applications that are significantly increasing storage requirements. (Sources: 4,3)

The planned timetable sits alongside Micron’s broader production roadmap in the region. The firm is also advancing high‑bandwidth memory (HBM) packaging capacity aimed at hyperscale and AI customers, with that facility reported to start production earlier, in 2027, reflecting a multi‑pronged effort to serve cloud and data‑centre operators. Industry observers say these moves underline Micron’s strategy to concentrate NAND and advanced packaging capabilities in Singapore. (Sources: 4,6)

Singapore has long been central to Micron’s flash-memory operations: the company already manufactures the bulk of its highest‑end NAND in the city‑state, which it terms a NAND centre of excellence. Government and industry commentary highlights the island’s role as a stable production base and a site for further investment in semiconductor research and talent, including public funding for AI research through to 2030. (Sources: 3,1)

Market participants point to severe shortfalls in memory supply as a principal driver of the expansion. Executives in consumer electronics have warned that ongoing demand from AI data centres is siphoning memory chips away from traditional retail segments, with potential implications for the prices of phones, laptops and other devices if supply does not catch up. Micron says the new fab will help alleviate that pressure by adding substantial NAND output. (Sources: 1,2,5)

While Micron frames the build‑out as a forward‑looking response to AI‑driven market dynamics, the company’s statements are presented here as corporate plans rather than guaranteed outcomes; construction schedules, production yields and market absorption will determine the ultimate impact on global memory availability and pricing. Observers will be watching the ramp to wafer output in the second half of 2028 and the roll‑out of associated HBM packaging capacity in 2027 for signs that the supply crunch is easing. (Sources: 6,4)

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Source: Noah Wire Services